VLSI TECHNOLOGY, INC.
Patent Owner
Stats
- 40 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- May 03, 2005 most recent publication
Details
- 40 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 13,955 Total Citation Count
- Aug 29, 1978 Earliest Filing
- 583 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
6889162 Wafer target design and method for determining centroid of wafer targetMar 07, 00May 03, 05[G01B]
6876063 Method of improving adhesion of cap oxide to nanoporous silica for integrated circuit fabricationJul 09, 01Apr 05, 05[H01L]
6766025 Intelligent speaker training using microphone feedback and pre-loaded templatesMar 15, 99Jul 20, 04[H04R]
6748006 Method and apparatus for controlling system timing with use of a master timerMay 28, 99Jun 08, 04[H04L]
6549563 Methods and apparatus for use in generating spreading sequences for multiple modes of communicationOct 19, 00Apr 15, 03[H04B]
6544860 Shallow trench isolation method for forming rounded bottom trench cornersMar 06, 00Apr 08, 03[H01L]
6539049 Device and method for maintaining time synchronous with a network master timeMay 28, 99Mar 25, 03[H04B]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
6756316 Semiconductor pressure transducer structures and methods for making the sameExpiredMay 04, 99Jun 29, 04[H01L]
6751579 Method of scaling table based cell library timing models in order to take into account process, temperature and power supplyExpiredMar 09, 99Jun 15, 04[G06F]
6727166 Removal of silicon oxynitride material using a wet chemical process after gate etch processingExpiredNov 17, 99Apr 27, 04[H01L]
6691277 High speed pre-computing circuit and method for finding the error-locator polynomial roots in a Reed-Solomon decoderExpiredNov 12, 98Feb 10, 04[H03M]
6636575 Cascading PLL units for achieving rapid synchronization between digital communications systemsExpiredAug 05, 99Oct 21, 03[H03D]
6625637 Method and apparatus for synthesizing communication support based on communication types of applicationExpiredDec 09, 99Sep 23, 03[G06F]
6580706 Efficient generation within a remote base station of a synchronization signal for a cordless communication systemExpiredMay 17, 99Jun 17, 03[H04J]
6581124 High performance internal bus for promoting design reuse in north bridge chipsExpiredMay 14, 98Jun 17, 03[G06F]
6574691 Apparatus and method for interfacing a non-sequential 486 interface burst interface to a sequential ASB interfaceExpiredJul 28, 99Jun 03, 03[G06F]
6567392 Method and system for using vocorder rate determination for high quality CDMA voice transmissionExpiredSep 24, 99May 20, 03[H04B]
6567428 Method and system for using low data rate vocorder packets to multiplex signaling packets into a CDMA traffic channel for high quality CDMA voice transmissionExpiredSep 24, 99May 20, 03[H04J]
6546514 Integrated circuit analysis and design involving defective circuit element replacement on a netlistExpiredDec 13, 99Apr 08, 03[G01R]
6541283 Method for determining magnification error portion of total misalignment error in a stepperExpiredOct 21, 99Apr 01, 03[H01L]
6541359 Optimized gate implants for reducing dopant effects during gate etchingExpiredJan 31, 00Apr 01, 03[H01L]
6542855 Selecting a cache design for a computer system using a model with a seed cache to generate a traceExpiredMay 10, 99Apr 01, 03[G06F]
6543018 System and method to facilitate flexible control of bus drivers during scan test operationsExpiredDec 02, 99Apr 01, 03[G01R]
6543030 Computer-implemented conversion of combination-logic module for improving timing characteristics of incorporating integrated circuit designExpiredMay 07, 99Apr 01, 03[G06F]
6529790 Computation of die-per-wafer considering production technology and wafer sizeExpiredDec 28, 99Mar 04, 03[G06F]
6522940 Method and system for varying die shape to increase wafer productivityExpiredDec 28, 99Feb 18, 03[G06F]
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